X-ray Nondestructive Tester - Application in the SMT Industry

2019-03-20

X-RAY Nondestructive Tester - Application in the SMT Industry


SMT industry analysis and application range:

BGA, PCBA soldering inspection (bridged open cold soldering cavity, etc.)

Partial condition of ultra-fine parts such as system LSI (broken wire, continuous welding)

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SMT process defect introduction

(1) BGA PCBA voids, bubbles. Cause: The solder paste is not evenly stirred, and the gas is generated when the solder paste is melted.



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Bubble detection process
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2) BGA PCBA with tin, biased. Cause: There may be problems with tin solder printing, and the printing process needs to be checked. The bias may be that there is no alignment when mounting.

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3) BGA PCBA cold welding, virtual welding, less ball. Cause: Most of the problems are caused by printing.

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